« Previous Release | Next Release »

July 17, 2002

Microsemi Introduces Two New Photodiode Families for Datacom/Telecom Broadband Application

  • Coplanar Waveguide Photodiodes and Arrays Suited for Flip Chip Core Wire Bond Assembly

  • Designed For Advanced Gallium Arsenide and Indium Gallium Arsenide Fabrication Process

  • Higher Performance 50Ohm Characteristic Impedance

  • Large Bond Pads Cut Customer Assembly Cost


    • Irvine, Calif. – (Business Wire) July 17,2002 -- Microsemi Corporation (Nasdaq: MSCC), a leading manufacturer of analog and mixed signal integrated circuits, has announced two new coplanar waveguide (CPW) photodiode families targeting applications in 1/10 Gigabit Ethernet, Fibre Channel, Infiniband, VCSEL and SONET/SDH OC48 and OC192 systems.

    The two photodiode families -- designed using advanced gallium arsenide (GaAs) and indium gallium arsenide (InGaAs) fabrication technology -- provide a choice of single die or photodiode arrays, targeting 850 nanometer and 1310/1550 nanometer optical wavelengths for applications using 3.125, 10, or 12.7 Gbps data rates.

    “Because these photodiodes are designed with easier assembly in mind -- to cut production costs – we see the LX304x™ and LX305x™ Series as providing attractive choices for manufacturers of broadband systems equipment,” said Paul Bibeau, Microsemi Vice President of Corporate Marketing.

    The new photodiodes feature 75 microns square anode and cathode pads that facilitate faster and more reliable self-alignment for either wirebond or flip chip assembly. Their impressive performance results in part from a 50-Ohm characteristic impedance-matched design that minimizes electrical reflections and noise.

    “These two new photodiode families compliment our planned portfolio of communications products that will include transimpedance amplifiers and laser drivers for both datacom and telecom applications,” added Glen Hartman, Microsemi Communications Products Marketing Manager.

    The LX3044™ single 10Gbps photodiode, the LX3045™ 10Gbps 1x4 array, and the LX3046™ 10Gbps 1x12 array are designed using GaAs for 850 nanometer wavelength for datacom applications including VCSEL laser and optical backplane.

    Targeting datacom and telecom applications that include Metro and Enterprise 10GBE systems, are Microsemi’s new 1310/1550 nanometer wavelength single-die InGaAs photodiodes: the LX3051™ -- a 3.125Gbps/ 80micron aperture device; and the LX3050™ -- a 12.7Gbps/32 micron aperture device. The LX3052™ provides a 12.7Gbps/32micron aperture 1x4 array for these same applications.

    Bare die LX304x Series photodiode prices start at $15 in 1K quantities and 1x4 arrays at $50 in like quantities. LX305x bare die photodiodes start at $35 and 1x4 arrays at $250, again in 1K quantities.

    Complete technical information is available on the Microsemi web site, www.Microsemi.com. Die samples can be ordered through this site, or from Microsemi sales representatives and franchised distributors.

    NOTE: A digital photograph for this press release can be down-loaded from the Microsemi web site, located within the News section found on the home page.


    About Microsemi

    Microsemi is a leading designer, manufacturer and marketer of analog, mixed-signal and discrete semiconductors. The company's semiconductors manage and regulate power, protect against transient voltage spikes and transmit, receive and amplify signals.

    Microsemi products include individual components as well as complete circuit solutions that enhance customer designs by providing battery optimization, reducing size or protecting circuits. Markets the company serves include mobile connectivity, computer/peripherals, telecommunications, medical, industrial/commercial, space/satellite and military.

    More information may be obtained by contacting the company directly or by visiting its web site at www.Microsemi.com.

    Please read the following factors that can materially affect Microsemi’s future results.

    "Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in the news release that are not entirely historical and factual in nature are forward-looking statements. For instance, all statements of belief and expectations are forward-looking statements. Forward-looking statements are inherently subject to risks and uncertainties, some of which cannot be predicted or quantified. Potential risks and uncertainties include, but are not limited to, such factors as the difficulties regarding the making of estimates and projections, hiring and retention of qualified technical personnel in a competitive labor market, acquiring and integrating new operations or assets, closing or disposing of operations or assets, rapidly changing technology and product obsolescence, the ability to realize cost savings or productivity gains, the ability to improve capacity utilization, potential cost increases, the strength and competitive pricing environment of the marketplace, demand for and acceptance of the company's products, the results of in-process or planned development, marketing and promotional campaigns, changes in demand for products, difficulties foreseeing future demand, effects of limited visibility of future sales, potential non-realization of expected orders or non-realization of backlog, business and economic conditions or adverse changes in current or expected industry conditions, business disruptions, future effects of the tragic events of Sept. 11, customer order preferences, fluctuations in market prices of the company's common stock and availability of additional capital on favorable terms, difficulties in implementing company strategies, environmental matters, litigation, difficulties protecting patents and other proprietary rights, inventory obsolescence. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K filed on Dec. 24, 2001, the Form 10-Q filed on Feb. 13, 2002, and May 10, 2002, and the final prospectus on Form S-3 filed on June 1, 2000, each filed by the company with the Securities and Exchange Commission. The company does not undertake to supplement or correct any information in this release that is or becomes incorrect.


    FINANCIAL CONTACT: David R. Sonksen
    Executive Vice President and Chief Financial Officer
    Tel: (949) 221-7101

    EDITORIAL CONTACT: Cliff Silver
    Manager, Corporate Communications
    Tel: (949) 221-7112


    Close window | Back to top

    Copyright 2013 Microsemi Corporation